Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval

Product Categories

WenYI Electronics Electronics Co.,Ltd

Contact Now

Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval

Name: Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval
Brand: Wenyi Electronics
Price: 1 USD

Best Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval wholesale

Brand Name : Wenyi Electronics

Model Number : GPI-Flex-C-010

Certification : RoHs,SGS，ISO9001:2008

Place of Origin : Made In China

MOQ : 500 pcs/ lot

Price : Negotiable

Payment Terms : T/T, L/C, D/A, D/P, Western Union, MoneyGram

Supply Ability : 20000 square meters/ month

Delivery Time : 12-15 working days afer sample approval

Packaging Details : each in ploybag, then in carton box, or as per request.

Material : 1 OZ copper

layer : 1-8 layers

Print : silkscreen

Finger : sink gold or tin plated

Type : LGF Backlight module

Application : Mobile Smart Device backlight

Contact Now

Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval

Item decription:

Mobile Smart Device Backlight LGF Module FPC Flexible Printed Circuit

Material: Polymide, LGF

Cover film: PI cover film

Type: LGF backlight module ( LED backlight )

Copper : 0.5 OZ

Finger Pitch: 1 mm gold finger

Stiffener: PI

Thickness: 0.27mm -0.36mm.

Business Terms:

MOQ : 500 pcs/ lot

Sample lead time: 8-12 working days

Mass production lead time: 10-14 working days , as per order Qty.

Payment By T/T or LC or others.

Our Advantage:

Strong R&D capability
Stable in quality
Experienced in backligth LGF module
Quick delivery
Capable to make 1-8 layers FPC
perfect quality control process.

Application:

* Household appliances
* Security systems, Bank POS machine payment service system.
* High Precision PCB and High Density PCB
* Various Mobile Smart Device use
* Various Mobile device FPC and Circuit module

Technical specification:

FPC Manufacturing Capability	Technical Performance Data
Finished FPC Size	Min.:4x4mm Max.:250x1200mm
FPC Board Thickness:	0.08-0.12mm for single layer, 0.12-0.22mm for double layer
Stiffener Material Choice	PI.PET,FR4-PI
Pitch of the Pin	0.3mm, 0.5mm,0.8mm,1.0mm, 1.25mm,2.54mm
Finished Board Thickness Tolerance	±0.03mm
Finished hole diameter(Min.)	0.15mm
Finished hole diameter(Max)	0.6mm
NPTH Hole diameter tolerance	±0.025mm
PTH hole diameter tolerance	±0.050mm
Copper foil thickness	18um,35um,70um/
Circuit width/spacing(Min.)	≥0.065mm(1/2oz)≥0.05mm(1/3oz)
Surface Finished type	OSP.Gold plating,Immersion Gold,Tin plating(lead free)etc
Gold Flash Ni/Au thickness	Ni:2.54-9um Au:0.025-0.5um
Immersion Tin thickness	0.7-1.2um
Tin plating thickness	3-15um
Drill hole position tolerance	±0.05mm
Punching dimension tolerance	±0.05mm
Certificate	ROHS,UL,ISO9001 SGS, etc

Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval

Product Tags:

rigid flex circuits

all flex flexible circuits

Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	WenYI Electronics Electronics Co.,Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!